CMOS Coming Out Party?
CMOS Image Sensors: Imaging Systems On a Chip
Top: Progression path for on-chip logic integration, present system boundaries (shown by dotted lines) will eventually merge to produce single chip imaging solutions.The Imaging Market and Key Technologies
The market for image sensors has undergone a dramatic shift in the
last five years. Up to the mid 90's the imaging market was
dominated by CCDs, however, advances in CMOS fabrication
technology, the need for low power portable devices and price
pressures have been responsible for enabling CMOS imaging
technology to become a serious contender to the mainstream CCD
technology. CMOS sensors accounted for less than 10% of the 90
million imagers shipped in 1999, however, their sales are expected
to grow to over 50% of the 300 million imagers expected to be sold
by the year 2004. This explosive growth will be partially fuelled
by existing applications such as fax machines, scanners, security
cameras, and camcorders. It will be, however, the other rapidly
growing applications in the consumer imaging industry such as
digital still cameras, toy and PC cameras, cameras for cell phones
and PDAs, biometrics, and automobiles which will result in the
exponential growth in both the imaging market and consequently the
market share of CMOS imagers.
Growth in markets for both CMOS and CCDs is expected to remain
strong for the next five years. Both technologies will establish
their respective niches based on their strengths and weaknesses.
While sales for CCDs are expected to remain strong in the high
resolution applications and in captive markets such as camcorders,
the usage of CMOS sensors will experience steady growth in the
lower end, but high volume, consumer applications that are driven
by power consumption and cost.
The first CCD was invented at the Bell Labs; it was not long before
that CMOS image sensors were announced. The limitations of the
available CMOS process at the time made the performance of these
sensors unacceptable for most applications and the technology lay
dormant till the late 1980's. Starting in the 1990's with the
availability of sub-micron CMOS processes that offered considerably
reduced leakage currents and noise, the interest amongst the
technical community in CMOS sensors started to grow once again. The
early pioneering work came from researchers at the Edinburgh
University in Scotland and the Jet Propulsion Laboratory (JPL) in
California. Since then, a number of key semiconductor suppliers
whom already have access to leading edge CMOS processes have
started to assimilate imagers into their product lines.
Sensors at Work
Solid state imagers, including CCDs and CMOS imagers, use a
particular physical property of silicon called the photoelectric
effect. When photons strike silicon, they excite electrons from the
valence band to the conduction band. The number of electrons thus
"freed" are proportional to the photon flux or simply the number of
photons striking silicon and their wavelength. Thus in effect the
number of electrons collected vary with the intensity and the color
of the illumination. If these electrons can be collected, metered,
and measured — an electronic representation of the incident
scene can be created and stored. For a typical imaging application,
the scene is focussed on the pixel array with the help of an
optical lens for spatial sampling. The size and number of pixels
ultimately determines the minimum size features that the sensor is
able to resolve. In this regard the larger the number of pixels,
the finer is the sensor's resolution. The pixel is the eye of the
sensor, and its conversion efficiency of photons to electrons
determines its sensitivity. This is typically a function of the
size and aperture of the pixel. The charge to voltage conversion
ratio is also important since ultimately the electron charge packet
has to be converted to a signal that can be measured and
manipulated for signal processing.
As the pixels are typically laid on an orthogonal grid (for area
arrays), a mechanism has to exist to readout all the rows and
columns of individual pixels that comprise the sensor. Up to this
point, CMOS and CCD sensors are identical in their functionality.
It is only in the implementation where these two differ.
The fabrication technology for CCDs has not been subject to much
evolution since its invention. CCDs have to be fabricated on NMOS
processes. The pixel sizes are rarely constrained by the minimum
feature size that the process allows. As a result, the process
technology for CCDs has not seen a significant change in the last
30 years. Perhaps the most significant shift has been in the area
of yields; improved yields now allow manufacturers to produce
multi-megapixel resolution CCD sensors in volume. Slow equipment
evolution has also forced CCD manufacturers to continue using 4"-6"
wafer fabrication lines where the rest of the industry is on the
8"-12" curve. The mismatch in processing technology for CCDs
precludes the integration of additional on-chip functionality
beyond light sensing and charge-to-voltage conversion. The result
— all signal processing has to be done off-chip with CMOS
ICs. The inherent advantages of CMOS processes form the basis of
the advantages of CMOS imagers. First, CMOS sensors can take full
advantage of the economies of scale offered by this technology,
hence keep costs low. Second, the products can be run on most
commercially available sub micron CMOS processes with minimal
changes thus allowing fabless design houses to just as easily
manufacture at foundries. Third, since CMOS sensors are
manufactured on the same processes as those for other analog and
digital signal processing circuits, virtually any functionality can
be integrated on chip, thereby reducing the number of components
and achieving lower system cost. Fourth, CMOS ICs run on 3.3V power
supply and are rapidly moving to 2.5V. CCDs, on the other hand, use
a 15V power supply. The power requirements for CCDs makes it
difficult to integrate them into portable, low power applications
such as cell phones, PDAs and other hand held scanning devices.
in the Bayer pattern.
CMOS Coming On
With that said, CMOS sensors have their own set of problems. They
face the daunting task of unseating a proven and mature technology
that already has several captive markets. The image quality of CMOS
sensors can vary significantly between different manufacturers and
in most cases is not at par with the CCDs. The main issue at hand
with CMOS sensors is their noise performance. These sensors use
active pixels, hence their alternate name Active Pixel Sensors
(APS). Each pixel has an amplifier that converts the collected
charge packet to a voltage. Mismatches in transistors can result in
mismatches in amplifiers thus causing a mismatch in the
A representative architecture of a CMOS imager (designed by Motorola).
response of pixels. The other major source of noise is the dark
leakage current which results in collection of thermally generated
charge that contaminates the photo electrically generated charge
that is collected from the incident scene. Since each pixel has an
amplifier, the entire pixel area cannot be used for photon
detection. This results in the aperture or fill factor being less
than 100% causing a drop in sensitivity and the output signal. As
the signal drops and the noise floor rises, the net signal-to-noise
ratio (SNR) deteriorates resulting in a lower system dynamic range.
Some of this loss is offset by the fact that all signal processing
is done on chip, close to the signal source. Improved mixed signal
design methodologies have also resulted in substantially reducing
these noise sources. Advances have thus resulted in image quality
of CMOS sensors that was barely acceptable a decade ago, being
comparable to that of CCDs today.
The future for CMOS technology looks bright (as does the image
quality). The continued development of this technology should have
a dramatic effect on the digital camera market — perhaps much
sooner than originally anticipated.
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